| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device with reduced polishing time.SOLUTION: In a polishing apparatus 1, a control section 60 controls operation of an XYZ stage 20 so that moving speed of a polishing member 42 on a mask substrate 10 is substantially constant, and also controls operation of a servomotor 33 and a pressing mechanism 50 so that at least one of rotational speed of a polishing tool 40 (the polishing member 42) and polishing pressure by the pressing mechanism 50 is changed according to a shape of the mask substrate 10. |
