| 摘要 |
The following invention relates to high energy capacitors with increased thermal resilience over conventional bulk ceramic capacitors, particularly capacitors that may be formed into a three dimensional shape to fit inside an existing device. The capacitor is provided with first and second electrodes (16, 17) which have a plurality of interlocating protrusions (11, 12), which increase the relative surface area of the electrodes. The first and second electrodes (16, 17) and interlocating protrusions (11, 12) are provided with through holes (29). The devices are filled with a flowable dielectric material. |
