发明名称 HIGH-SPEED SUBSTRATE ARRANGEMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate arrangement apparatus which provides minimal substrate transfer device's extending and retracting motions to quickly arrange substrates without damaging a back side of the substrate while increasing the throughput of substrate processing.SOLUTION: A substrate arrangement apparatus 105 has an inverted chuck section 206 connected to a frame 205. The frame 205 has a substrate transfer system which transfers substrates from the inverted chuck section 206 to the substrate transfer device without rotationally rearranging the substrates. The inverted chuck section 206 eliminates obstructions of substrate fiducials when the substrates are arranged, and, along with the substrate transfer system, allows the substrate transfer device to remain within the frame 205 during substrate arrangement.
申请公布号 JP2014013925(A) 申请公布日期 2014.01.23
申请号 JP20130181312 申请日期 2013.09.02
申请人 BROOKS AUTOMATION INC 发明人 JAIRO TERRA MOURA;MARTIN HOSEK;TODD BOTTOMLEY;ULYSSES GILCHRIST
分类号 H01L21/683;H01L21/68 主分类号 H01L21/683
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