发明名称 Polymer Composition for Microelectronic Assembly
摘要 Embodiments in accordance with the present invention encompass polymer compositions that act as both a tack agent and a fluxing agent for the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions embodiments encompass a sacrificial polymer, a carrier solvent, a thermal acid generator and, optionally, formic acid.
申请公布号 US2014024750(A1) 申请公布日期 2014.01.23
申请号 US201314039433 申请日期 2013.09.27
申请人 PROMERUS, LLC 发明人 APANIUS CHRISTOPHER;BELL ANDREW;LANGSDORF LEAH;TSANG W. C. PETER
分类号 B23K35/362;C08K5/07;C08K5/09;C08K5/1535;C08K5/42;C08K5/55 主分类号 B23K35/362
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