HEAT DISSIPATION APPARATUS

摘要

A heat dissipation apparatus includes a motherboard has a first heat source and a second heat source thereon, a heat transmission module and a cooling fan. One terminal of the heat transmission module contacts the first heat source. The heat transmission module transmits heat from the first heat source to another terminal of the heat transmission module. The cooling fan has a first air inlet opening, a first air outlet opening and a second air outlet opening. The first air outlet opening faces the another terminal of the heat transmission module. The second air outlet opening faces the second heat source. The cooling fan rotates and generates airflow that flows from the first air outlet opening to the another terminal of the heat transmission module. The cooling fan rotates and generates airflow that flows from the second air outlet opening to the second heat source.