发明名称 HEAT PIPE COB LED MODULE AND LAMP THEREWITH
摘要 The present invention relates to a heat pipe COB LED module for a light and a light using the same. The LED module for a light provides an integrated heat pipe (15) in which a cooling medium is filled at the bottom of a printed circuit board (10) of the LED module and a plurality of heat dissipation fins (17) at the bottom of the heat pipe wherein an electrode plate (11) is fixed to the upper edge part of the printed circuit board (10) made of copper. A dam (12) is fixed to the edge part of the electrode plate. Multiple LEDs (13) are installed at the upper surface of the printed circuit board (10) and electrically connected to each other by a wire bonding (14). A transparent resin layer (8) made of YAG for the protection of the LEDs and fluorescence and a silicon mixture is entirely formed on the printed circuit board (10). The present invention extends the lifetime of the LED module by forming the heat pipe with the heat dissipation fins on the LED module and efficiently dissipating heat generated at the printed circuit board of the LED module. Also, the present invention improves the convenience of use instead of an existing light bulb by forming a socket part at the side or rear of the LED module.
申请公布号 KR101353616(B1) 申请公布日期 2014.01.23
申请号 KR20130059731 申请日期 2013.05.27
申请人 KOREA SUNLED CO., LTD. 发明人 LEE, SEONG HEON
分类号 F21V29/00 主分类号 F21V29/00
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