| 摘要 |
<p>A method of bonding a nanodimensional interface for fine pitch interconnect based on alloy composition is provided, characterized in that, the method includes the steps of depositing a first layer of metal deposit (11) covering a metal contact (10), depositing a first bonding material (12) over the first layer of metal deposit (11), depositing a second bonding material (13) over the first bonding material (12), such that the first bonding material (12) and the second bonding material (13) form intermetallic bonds when heated, repeating a plurality of first bonding material (12) and second bonding material (13) layers alternately, wherein each layer is in a nanometer thickness range, wherein a mushroom shaped top is produced by chemical etching as an adhesion enhancement feature (15).</p> |
