| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition allowing formation of a plated conductor layer having reduced arithmetic average roughness of an isolation layer surface, decreased root mean square roughness and also sufficient peel strength in a wet roughing process, and being excellent in laminate properties.SOLUTION: A resin composition contains an epoxy resin, a curing agent, and an inorganic filler the surface of which is treated with an alkoxysilane compound. |
