发明名称 FILM INSERT MOLDING FOR DEVICE MANUFACTURE
摘要 Systems and methods provide for a device including a film having a shape that defines an interior region. The device may also include one or more electronic components disposed within the interior region of the film, and a hardened thermo-set resin within the interior region, wherein the thermo-set resin encompasses the electronic components and substantially fills the interior region of the film. In one example, printed content is coupled to a surface of the film. In addition, the thermo-set resin may include an additive that is configured to absorb and distribute heat generated by the electronic components.
申请公布号 US2014022720(A1) 申请公布日期 2014.01.23
申请号 US201213997871 申请日期 2012.05.17
申请人 DAVISON PETER;PIDWERBECKI DAVID 发明人 DAVISON PETER;PIDWERBECKI DAVID
分类号 H05K7/02;B29C39/10 主分类号 H05K7/02
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