发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To reduce an element area and reduce contact resistance in a semiconductor device having a configuration for short circuiting a gate electrode and an active region.SOLUTION: A semiconductor device comprises: a semiconductor substrate having a first region; a gate electrode formed on the semiconductor substrate in the first region; a first active region formed on the semiconductor substrate in the first region; a first silicide layer formed on a top face and a lateral face of the gate electrode in the first region; and a contact via plug which touches the silicide layer at least on the lateral face of the gate electrode and the first active region.
申请公布号 JP2014013792(A) 申请公布日期 2014.01.23
申请号 JP20120149745 申请日期 2012.07.03
申请人 FUJITSU SEMICONDUCTOR LTD 发明人 TSUKIDATE ITSUWA
分类号 H01L21/336;H01L21/28;H01L21/76;H01L21/768;H01L21/8238;H01L23/522;H01L27/092;H01L29/41;H01L29/417;H01L29/423;H01L29/49;H01L29/78 主分类号 H01L21/336
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