发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To reduce an element area and reduce contact resistance in a semiconductor device having a configuration for short circuiting a gate electrode and an active region.SOLUTION: A semiconductor device comprises: a semiconductor substrate having a first region; a gate electrode formed on the semiconductor substrate in the first region; a first active region formed on the semiconductor substrate in the first region; a first silicide layer formed on a top face and a lateral face of the gate electrode in the first region; and a contact via plug which touches the silicide layer at least on the lateral face of the gate electrode and the first active region. |
申请公布号 |
JP2014013792(A) |
申请公布日期 |
2014.01.23 |
申请号 |
JP20120149745 |
申请日期 |
2012.07.03 |
申请人 |
FUJITSU SEMICONDUCTOR LTD |
发明人 |
TSUKIDATE ITSUWA |
分类号 |
H01L21/336;H01L21/28;H01L21/76;H01L21/768;H01L21/8238;H01L23/522;H01L27/092;H01L29/41;H01L29/417;H01L29/423;H01L29/49;H01L29/78 |
主分类号 |
H01L21/336 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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