发明名称 SOCKET DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a socket device which increases contact load between a substrate and bus bars and improves contact stability.SOLUTION: A socket device 11 comprises a socket body 21 which is to be inserted into a substrate opening 23 formed on a printed wiring board 15 and to which a wedge bulb 13 is mounted; a flange 79 which is provided to the socket body 21 and abuts on a substrate surface side 27; substrate fixing protrusions 85 which are inserted to notches 25 formed on the substrate opening 23 at both ends in a diameter direction; bus bars 19 which are stored in the socket body 21 and conducting to lead wires 37 exposed on wedge bases 35; substrate contact springs 59 formed on bus bars 19 at positions higher than that of substrate holding faces 97 of the substrate fixing protrusions 85 and contacting a conductive face 31 formed on a substrate rear side 29 with the socket body 21 being rotated against the printed wiring board 15; and substrate picking faces 67 provided to the substrate contact springs 59 and facing substrate notch edges 69 of the notches 25.
申请公布号 JP2014013653(A) 申请公布日期 2014.01.23
申请号 JP20120149670 申请日期 2012.07.03
申请人 YAZAKI CORP 发明人 MURATA ATSURO
分类号 H01R33/09 主分类号 H01R33/09
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