| 摘要 |
PROBLEM TO BE SOLVED: To provide a structure that can achieve a uniform polishing rate without thickening an interlayer insulation film associated with a film to be polished in a substrate for a liquid crystal panel having a laminated film structure formed by alternately and repeatedly depositing interlayer insulation films and metal layers on a semiconductor substrate.SOLUTION: A substrate is provided with a connection plug 15 for conductively connecting a wiring film 10 constituted of a first metal layer with a second interlayer insulation film 11 below a light shielding film 12 interposed between the wiring film 10 and the light shielding film 12 and a pixel electrode constituted of a third metal layer with a third interlayer insulation film 13 on the light shielding film 12 interposed between the pixel electrode and the light shielding film 12, through an opening 12a opened through the light shielding film 12 constituted of a second metal layer in a pixel region. Lower layer dummy patterns A constituted of the first metal layer and upper layer dummy patterns B constituted of the second metal layer are laminated and formed around an input terminal pad 26 of a non-pixel region. Since a deposition surface level of the third interlayer insulation film 13 above the dummy patterns A and on the dummy patterns B is raised, excessive polishing in those portions can be eliminated, and a uniform polishing rate can be obtained in CMP processing. |
