| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device excellent in assemblability and a method for manufacturing the semiconductor device.SOLUTION: Semiconductor modules 40, 41, 42, a first plate spring 50, and a first spring pressing member 60 are arranged on an upper surface in a center bracket 20, the first semiconductor modules 40, 41, 42 are brought into pressure contact with a cooler 30, and the cooler 30 is fastened so as to be held. Second semiconductor modules 80, 81, 82, a plate spring 90, and a plate spring pressing member 100 are arranged on a lower surface of the center bracket 20, and the second semiconductor modules 80, 81, 82 are fastened so as to be brought into pressure contact with the cooler 30. |
