| 摘要 |
<p>This electronic device is provided with a first molded product (10) that is integrated with an electronic component (30), and a second molded product (20) that is secondarily formed on the outside of the first molded product (10). The first molded article comprises a thermosetting resin and a first additive contained therein. The second molded article (20) comprises a thermoplastic resin, and a second additive that is contained therein and has a reactive group that chemically bonds with the first additive. At the interface between the first molded article (10) and the second molded article (20), the first additive and the second additive are joined by one or more joining effects selected from a covalent bond, an ionic bond, a hydrogen bond, intermolecular forces, dispersion forces, and diffusion. Thus, the adhesion of both molded articles can be firmly maintained by a molding method such as transfer molding or compression molding.</p> |
