GATE STRUCTURE, SEMICONDUCTOR COMPONENT, AND METHODS FOR FORMING BOTH
摘要
<p>The present disclosure relates to a gate structure, a semiconductor component, and methods for forming both. Provided in the present disclosed embodiments is the method for forming the gate structure, comprising: providing a substrate; forming an interface layer on the substrate; forming a gate dielectric layer on the interface layer; forming a gate dielectric protective layer on the gate dielectric layer; forming an etching barrier layer on the gate dielectric protective layer; forming an oxygen-adsorbing element layer on the etching barrier layer; forming an oxygen-adsorbing element protective layer on the oxygen-adsorbing element layer; performing annealing after metallization; performing etching until the etching barrier layer is exposed; forming a work function adjustment layer on the etching barrier layer; and forming a gate layer on the work function adjustment layer. The method provided in the present disclosed embodiments for forming the gate structure allows for effectively reduced equivalent gate oxide layer thickness.</p>
申请公布号
WO2014012264(A1)
申请公布日期
2014.01.23
申请号
WO2012CN79091
申请日期
2012.07.24
申请人
INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OFSCIENCES;YANG, HONG;WANG, WENWU;YIN, HUAXIANG;YAN, JIANG;MA, XUELI