| 摘要 |
PROBLEM TO BE SOLVED: To fabricate analog and digital circuits on separate dies, and stack and integrate the dies within a single package to form a mixed-signal IC that provides many advantages.SOLUTION: The analog and digital circuits are implemented on two separate dies by using different IC processes suitable for different types of circuits. An analog die 130 and a digital die 120 are thereafter integrated (stacked) and encapsulated within a single package 110. Bonding pads 122, 124, 132, 134 are provided to interconnect the dies and to connect the dies to external pins. The bonding pads may be located and arranged in a manner of providing required connectivity while minimizing the size of die area required to implement the pads. In another aspect, the die-to-die connectivity may be tested in conjunction with a serial bus interface. |
