<p>A printed circuit board that includes a dielectric polymer layer having a thermally conductive agglomerate filler and an electrically conductive layer bonded to the dielectric polymer layer is provided. Methods of producing the printed circuit board are also provided. The subject printed circuit board and methods find use in a variety of different applications, including electronics applications.</p>
申请公布号
WO2014014947(A1)
申请公布日期
2014.01.23
申请号
WO2013US50738
申请日期
2013.07.16
申请人
HEDIN, LOGAN, BROOK;MILLER, DAVID, MICHAEL;CONLEY, NICHOLAS, RYAN
发明人
HEDIN, LOGAN, BROOK;MILLER, DAVID, MICHAEL;CONLEY, NICHOLAS, RYAN