| 摘要 |
<p>The present invention relates to a preparation method for cross-sectional morphology analysis sample of a MEMS component, which comprises the following steps: slicing the sample to be analyzed to obtain a sample slice; mixing transparent plastic powder with special hardening agent to a paste, and coating the paste on upper surface of the sample slice; preparing a transparent sheet, and pressing the transparent sheet on the surface of the sample slice coated with the plastic powder paste; curing said paste; polishing a first side surface of the sample slice until sectional surface to be observed appears. Because gaps in the overhanging comb structure of the MEMS component are filled with transparent plastic material in the present invention, the strength of the structure is enhanced, and collapse of the overhanging comb structure is avoided. The present invention is applicable to components having arbitrarily-oriented substrates, requires no use of expensive CVD devices, and can save costs compared to conventional methods using CVD deposited protective films.</p> |
