发明名称 |
Liquid Crystal Polymer Film Based Copper-Clad Laminate and Method for Producing Same |
摘要 |
Provided is a liquid crystal polymer film based copper-clad laminate characterized in that a surface of one side or each of both sides of a liquid crystal polymer film has a nitrogen atom content of 10 at % or more, and a metal conductor layer formed by dry plating and/or wet painting is provided on the surface of the liquid crystal polymer film having the nitrogen atom content of 10 at % or more. The liquid crystal polymer film based copper-clad laminate is characterized by having arithmetic average roughness Ra of 0.15 mum or less and a root-mean-square roughness Rq of 0.20 mum or less as surface roughness of the liquid crystal polymer film. Also provided is a method for producing a liquid crystal polymer film based copper-clad laminate characterized by performing plasma processing on the surface of the liquid crystal polymer film under a nitrogen atmosphere at a gas pressure of 2.6 to 15 Pa, followed by forming the metal conductor layer by dry plating and/or wet plating. |
申请公布号 |
US2014023881(A1) |
申请公布日期 |
2014.01.23 |
申请号 |
US201214000318 |
申请日期 |
2012.02.15 |
申请人 |
SAKAGUCHI KAZUHIKO;INAZUMI HAJIME;YACHI HISAKAZU;JX NIPPON MINING & METALS CORPORATION |
发明人 |
SAKAGUCHI KAZUHIKO;INAZUMI HAJIME;YACHI HISAKAZU |
分类号 |
B32B15/08;B32B15/20;C09K19/38 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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