| 摘要 |
<p>This production method for a sealing layer-coated semiconductor element comprises: an arrangement step in which a semiconductor element is arranged on a support base; a sealing step in which the semiconductor element is embedded and sealed by means of the sealing layer of a sealing sheet comprising a peeling layer and a sealing layer that is layered under the peeling layer, is made from a thermosetting resin, and is not completely cured; and a heating step in which, after the sealing step, the sealing layer is heated and cured. The heating step comprises: a first heating step in which the sealing sheet is heated at a first temperature under normal pressure; a peeling step in which, after the first heating step, the peeling layer is peeled from the sealing layer; and a second heating step in which, after the peeling step, the sealing layer is heated at a second temperature that is higher than the first temperature.</p> |
