| 摘要 |
This production method for a sealing layer-coated semiconductor element comprises: an arrangement step in which a semiconductor element is arranged on a support base; a sealing step in which the semiconductor element is embedded and sealed by means of the sealing layer of a sealing sheet comprising a peeling layer and a sealing layer that is layered under the peeling layer, that is made from a thermosetting resin, and that is not completely cured; and a heating step in which, after the sealing step, the sealing layer is heated and cured. The heating step comprises a first heating step in which the sealing sheet is oriented toward the support base and heated at a first temperature while mechanical pressure is applied, and a second heating step in which, after the first heating step, the sealing sheet is heated at a second temperature that is higher than the first temperature. |
