发明名称 SYSTEM AND METHODS FOR ELECTROWETTING BASED PICK AND PLACE ASSEMBLY
摘要 A system based on electrowetting facilitates high-volume assembly of objects including micron sized objects. A material handling component of the system includes an array of electrically controlled nodes that switch their adhesion property based on a voltage supply. The system accurately picks up and places objects including in parallel.
申请公布号 WO2014014892(A2) 申请公布日期 2014.01.23
申请号 WO2013US50650 申请日期 2013.07.16
申请人 CORNELL UNIVERSITY 发明人 APOORVA, FNU;MACCURDY, ROBERT;LIPSON, HOD
分类号 B65G54/02 主分类号 B65G54/02
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