| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for preparing a multi-layer substrate.SOLUTION: A method comprises the steps of: providing a first layer including a barrier region and a copper region; and depositing a second layer containing copper on the first layer. The depositing step provides the second layer with a first thickness ranging from about 20 Å to about 2,000 Å on the barrier region and a second thickness ranging from about 0 Å to about 1,000 Å on the copper region in the first layer. Thus, a multi-layer substrate including the first layer and the second layer is prepared, where the first thickness is greater than the second thickness. |
