发明名称 |
MANUFACTURING SYSTEM OF ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND MANUFACTURING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing system of an electronic component mounting substrate and a manufacturing method capable of increasing productivity of the electronic component mounting substrate.SOLUTION: The manufacturing system of an electronic component mounting substrate includes: a wiring formation material supply unit that forms a photocurable pattern by supplying a photocurable wiring forming material having fluidity in an area which includes a terminal joint position on the first plane of a circuit board having the first plane and a second plane opposite to the same; a mounting unit that mounts an electronic component having external terminals to a mounting position on the first plane so that the external terminals land on the terminal joint position; and a light irradiation device that irradiates light to the photocurable pattern to cure and form a conductive wiring pattern, and joints the external terminal to the conductive wiring pattern at the terminal joint position. |
申请公布号 |
JP2014013827(A) |
申请公布日期 |
2014.01.23 |
申请号 |
JP20120150645 |
申请日期 |
2012.07.04 |
申请人 |
PANASONIC CORP |
发明人 |
WADA YOSHIYUKI;SAKAI TADAHIKO;MOTOMURA KOJI |
分类号 |
H05K3/32;H01L21/60;H05K3/12;H05K3/34 |
主分类号 |
H05K3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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