发明名称 MANUFACTURING SYSTEM OF ELECTRONIC COMPONENT MOUNTING SUBSTRATE AND MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing system of an electronic component mounting substrate and a manufacturing method capable of increasing productivity of the electronic component mounting substrate.SOLUTION: The manufacturing system of an electronic component mounting substrate includes: a wiring formation material supply unit that forms a photocurable pattern by supplying a photocurable wiring forming material having fluidity in an area which includes a terminal joint position on the first plane of a circuit board having the first plane and a second plane opposite to the same; a mounting unit that mounts an electronic component having external terminals to a mounting position on the first plane so that the external terminals land on the terminal joint position; and a light irradiation device that irradiates light to the photocurable pattern to cure and form a conductive wiring pattern, and joints the external terminal to the conductive wiring pattern at the terminal joint position.
申请公布号 JP2014013827(A) 申请公布日期 2014.01.23
申请号 JP20120150645 申请日期 2012.07.04
申请人 PANASONIC CORP 发明人 WADA YOSHIYUKI;SAKAI TADAHIKO;MOTOMURA KOJI
分类号 H05K3/32;H01L21/60;H05K3/12;H05K3/34 主分类号 H05K3/32
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