| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate in which reliability of electrical and mechanical connection is improved.SOLUTION: A substrate, laminated structure, 10 includes: a first insulation layer 14 provided on a base substrate 12; a second insulation layer 15 provided on the first insulation layer 14; a third insulation layer 16 provided on the second insulation layer 15; and a pad electrode 17 provided on the third insulation layer 16. In the substrate 10, a hole that passes through the base substrate 12, the first insulation layer 14, the second insulation layer 15 and the third insulation layer 16 and reaches the pad electrode 17 from a second opposite side surface of the base substrate 12 is formed, and the substrate 10 has a fourth insulation layer 24 covering an inner wall of the hole and a conductor 32 that is connected to the pad electrode 17 and is covered with the fourth insulation layer 24 in the hole. A diameter of the first insulation layer 14 is larger than a diameter of the second insulation layer 15 in the hole. The first insulation layer 14 and the second insulation layer 15 are formed of different materials from each other, and the second insulation layer 15 and the third insulation layer 16 are formed of different materials from each other. |
