| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which has an adequate heat dissipation function and achieves high mass productivity.SOLUTION: A semiconductor device according to this invention includes: a housing 12; an electrode 14 including a fixing part 14A, which is fixed to the housing 12, and an extension part 14B which is connected with the fixing part 14A and has a first surface 14a and a second surface 14b at the opposite side of the first surface 14a; a semiconductor element 16 fixed to the first surface 14a; a metal member 24 which is fixed to the housing 12 so as to enclose a region located immediately below the second surface 14b with the housing 12; and an insulation liquid 26 which is sealed in a region enclosed by the metal member 24, the housing 12, and the second surface 14b. |
