发明名称 CONDUCTIVE PASTE FOR LASER ETCHING, CONDUCTIVE THIN FILM, AND CONDUCTIVE LAMINATE
摘要 <p>[Problem] To provide a conductive paste for laser etching, which is suitable for laser etching that is capable of producing a high-density electrode circuit wiring line having an L/S of 50/50 mum or less at low cost with a little burden on the environment, said high-density electrode circuit wiring line having been considered difficult to be produced by conventional screen printing methods. [Solution] A conductive paste for laser etching, which contains (A) a binder resin that is formed of a thermoplastic resin, (B) a metal powder and (C) an organic solvent; a conductive thin film that is formed using the conductive paste; a conductive laminate; an electrical circuit; and a touch panel.</p>
申请公布号 WO2014013899(A1) 申请公布日期 2014.01.23
申请号 WO2013JP68613 申请日期 2013.07.08
申请人 TOYOBO CO., LTD. 发明人 HAMASAKI, RYOU;OHMAE, SHINTAROU
分类号 H01B1/22;G06F3/041;H01B5/02;H01B5/14;H05K1/09;H05K3/08 主分类号 H01B1/22
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