发明名称 |
CONDUCTIVE PASTE FOR LASER ETCHING, CONDUCTIVE THIN FILM, AND CONDUCTIVE LAMINATE |
摘要 |
<p>[Problem] To provide a conductive paste for laser etching, which is suitable for laser etching that is capable of producing a high-density electrode circuit wiring line having an L/S of 50/50 mum or less at low cost with a little burden on the environment, said high-density electrode circuit wiring line having been considered difficult to be produced by conventional screen printing methods. [Solution] A conductive paste for laser etching, which contains (A) a binder resin that is formed of a thermoplastic resin, (B) a metal powder and (C) an organic solvent; a conductive thin film that is formed using the conductive paste; a conductive laminate; an electrical circuit; and a touch panel.</p> |
申请公布号 |
WO2014013899(A1) |
申请公布日期 |
2014.01.23 |
申请号 |
WO2013JP68613 |
申请日期 |
2013.07.08 |
申请人 |
TOYOBO CO., LTD. |
发明人 |
HAMASAKI, RYOU;OHMAE, SHINTAROU |
分类号 |
H01B1/22;G06F3/041;H01B5/02;H01B5/14;H05K1/09;H05K3/08 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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