发明名称 WIRELESS IC DEVICE
摘要 <p>It is an object of the present invention to provide a wireless IC device that allows a wide frequency band to be realized with a small-size power supply circuit substrate. A wireless IC device includes a wireless IC element (50), a power supply circuit substrate (31) including a laminate (32) of a plurality of base layers and a power supply circuit (33) connected to the wireless IC element (50), and a radiating element connected to the power supply circuit (33). The power supply circuit (33) includes a first coil element (L1) connected in series with the wireless IC element (50), and a second coil element (L2) connected in parallel with the wireless IC element (50). The first coil element (L1) and the second coil element (L2) are wound and arranged such that winding axes of the first and second coil elements (L1),(L2) coincide or substantially coincide with each other and directions of magnetic fields generated in the respective first and second coil elements (L1),(L2) are opposite to each other.</p>
申请公布号 EP2688145(A1) 申请公布日期 2014.01.22
申请号 EP20130742949 申请日期 2013.01.23
申请人 MURATA MANUFACTURING CO., LTD. 发明人 DOKAI YUYA
分类号 H01Q1/50;G06K19/07;G06K19/077;H01Q1/38 主分类号 H01Q1/50
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