| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board with a built-in component, which improves dissipation property in the built-in component without increasing a cost, and also to provide a method of manufacturing the same. <P>SOLUTION: The wiring board with the built-in component includes: a first insulating layer; a second insulating layer located by lamination with respect to the first insulating layer; an electronic component which is embedded in the second insulating layer and has a semiconductor chip having a first surface with a terminal and a second surface located oppositely to the first surface; a thermal conductor which is further embedded in the second insulating layer and has a first surface located oppositely to and spaced apart from the second surface of the semiconductor chip and a second surface located oppositely to and spaced apart from the edge of the semiconductor chip; an adhesive member arranged by filling between the electronic component and the thermal conductor; a wiring pattern held between the first insulating layer and the second insulating layer and including a connection land for the electronic component; and a conductive member which is held between the electronic component and the connection land of the wiring pattern, so as to electrically and mechanically connect the electronic component to the connection land. <P>COPYRIGHT: (C)2011,JPO&INPIT |
