| 发明名称 |
LEAD-FREE SOLDER ALLOY SUPPRESSED IN OCCURRENCE OF SHRINKAGE CAVITY |
| 摘要 |
<p>A lead-free solder alloy having improved surface properties which suppresses minute irregularities and shrinkage cavities has a composition consisting essentially of Ag: 0.1 - 1.5 %, Bi: 2.5 - 5.0 %, Cu: 0.5 - 1.0 %, optionally Ni: 0.015 - 0.035 % and/or at least one of Ge and Ga: 0.0005 - 0.01 %, and a remainder of Sn and unavoidable impurities.</p> |
| 申请公布号 |
EP2275224(B1) |
申请公布日期 |
2014.01.22 |
| 申请号 |
EP20090734301 |
申请日期 |
2009.04.23 |
| 申请人 |
SENJU METAL INDUSTRY CO., LTD |
发明人 |
KAWAMATA, YUJI;UESHIMA, MINORU;KANG, MIN;NAKAGAWA, KAYAKO;KOKUBU, YASUAKI |
| 分类号 |
B23K35/26;B23K1/00;B23K1/20;B23K35/02;B23K35/362;B23K101/42;C22C13/02;H01L21/60;H01L23/12;H01L23/488;H01L23/498;H05K3/34 |
主分类号 |
B23K35/26 |
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