发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR EPITAXIAL WAFER, SEMICONDUCTOR EPITAXIAL WAFER, AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP ELEMENT
摘要 A method of producing a semiconductor epitaxial wafer 100 according to the present invention includes a first step of irradiating a semiconductor wafer 10 with cluster ions 16 to form a modifying layer 18 formed from a constituent element of the cluster ions 16 in a surface portion 10A of the semiconductor wafer; and a second step of forming an epitaxial layer 20 on the modifying layer 18 of the semiconductor wafer 10.
申请公布号 KR20140009565(A) 申请公布日期 2014.01.22
申请号 KR20137032894 申请日期 2012.03.19
申请人 SUMCO CORPORATION 发明人 KADONO TAKESHI;KURITA KAZUNARI
分类号 H01L21/322;H01L21/20;H01L21/265;H01L27/146 主分类号 H01L21/322
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