| 摘要 |
[Problem] provided is a technique for quickly analyzing errors and managing the product of a semiconductor device without reducing the throughput of a post process. (Solution) Each identification information is allocated to materials (lead frame) used in a semiconductor device (QFP) manufacture and a transfer unit (rack, rot, stacker, etc) transferring the materials. The identification information of the transfer unit is connected to the identification information of the materials supplied to the corresponding transfer unit. When materials is output from the transfer unit set in the loader part of each manufacturing device, and the completely processed material is supplied to the transfer unit of the unloader of the device, the identification information of the transfer unit is combined with a connection (relation). |
