| 摘要 |
PURPOSE: An LED package structure with a high efficiency and high heat radiation structure and a manufacturing method thereof are provided to improve cooling efficiency by efficiently transmitting heat from an LED device through a module using a thin ceramic PCB. CONSTITUTION: A ceramic substrate (10) with a plurality of connection holes is prepared. An electrode circuit is printed on the upper surface of the ceramic substrate. A first reflection layer (20) is deposited on the ceramic substrate. A reflection plate (30) is bonded to the upper surface of the ceramic substrate. A second reflector layer (40) is deposited on the upper surface of the reflection plate. The ceramic substrate is bonded to the reflection plate by an adhesive (50). |
