Microelectronic device, stacked die package and computing system containing same, method of manufacturing a multi-channel communication pathway in same

摘要

A microelectronic device comprises a first surface (110, 710), a second surface (120, 720), and a passageway (130, 730) extending from the first surface to the second surface. The passageway contains a plurality of electrically conductive channels (131, 132, 231, 232) separated from each other by an electrically insulating material (133, 1133).