Semiconductor component support and semiconductor device

摘要

A semiconductor component support (20) is provided which includes a metal component support portion (31) for a semiconductor component (10) to be mounted on the semiconductor component support portion. The component support portion (31) includes a metal part (37) that includes an opening (35) in plan view. The opening of the metal part (37) includes a first section (351), and a second section (352). The second section (352) communicates with the first section (351), and is arranged outside the first section (351). The second section (352) is wider than the first section (351). The first section (351) can be at least partially positioned directly under a mount-side main surface of the semiconductor component (10).