HEAT TRANSFER DEVICE FOR DOUBLE-SIDED COOLING OF A SEMICONDUCTOR COMPONENT

摘要

The invention relates to a heat transfer device wherein two heat transfer bodies are adhesively connected to opposite sides on contact surfaces of a semiconductor component, extending beyond the semiconductor component. The heat conducting bodies have metal regions constituting the majority of the heat conducting bodies and being in electrical contact with the semiconductor component. An electrically insulating joining agent connects the metal regions of the heat conducting bodies adhesively to each other on the opposite side from the semiconductor component, or at least one of said metal regions to a further metal region of an intermediate body placed between the heat conducting bodies. At least one of the metal regions connected between the heat conducting bodies by the electrically insulating adhesive is disposed at least in segments between the contact surface planes.