| 摘要 |
The present invention provides an epoxy resin composition which has a low viscosity, can be cured at a low temperature in a short time, has excellent heat resistance, voltage resistance, electrical insulating properties, moisture resistance, mechanical strength and adhesive properties, has excellent solder ball reinforcing properties during sealing and has a long pot life; and a semiconductor sealing material using this epoxy resin composition. The epoxy resin composition comprises (A) an epoxy resin, (B) 1,4-cyclohexanedimethanol diglycidyl ether, (C) an imidazole-based latent curing agent and (D) a phenolic resin, and is characterized in that the content of the 1,4-cyclohexanedimethanol diglycidyl ether relative to the total mass of the epoxy resin (A) and the 1,4-cyclohexanedimethanol diglycidyl ether (B) is 0.5 to 80 mass %, the content of the imidazole-based latent curing agent (C) relative to the total mass of all the components in the epoxy resin composition is 5 to 25 mass %, and the content of the phenolic resin (D) relative to the total mass of all the components in the epoxy resin composition is 0.5 to 25 mass %. |
