CORELESS SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

A method for manufacturing a coreless printed circuit board according to the present invention includes the following steps of: (A) arranging at least one barrier plate structure which consecutively includes a first circuit layer and a first pillar in a direction of the barrier plate; (B) compressing the barrier plate structure corresponding to the first pillar on a first insulating layer which is positioned on one side or both sides of a carrier substrate; (C) removing the barrier plate and forming a second pillar which is connected to the first circuit layer; (D) forming a second insulating layer which buries the second pillar; (E) separating the carrier substrate; (F) flattening the first insulating layer and the second insulating layer; and (G) stacking multiple different insulating layers which consecutively include another circuit layer and another pillar on the outer surface of the second insulating layer which exposes the second pillar or on the outer surface of the first insulating layer which exposes the first pillar.