MASK SUBSTRATE ALIGNER, DEPOSITION APPARATUS COMPRISING THE SAME, CONTROLLING METHOD OF THE SAME, AND METHOD FOR ALIGNING MASK AND SUBSTRATE

摘要

Provided in the present invention are a mask substrate aligner, a deposition apparatus having the same, a controlling method thereof and a mask substrate aligning method capable of reducing the degradation occurrence rate by reducing a gap between a holder and a mask when the mask is seated on the substrate and effectively reducing the amount of a deposited material in the gap during the deposition. The method for controlling the mask substrate aligner comprises steps of: arranging the substrate on a plurality of substrate pins capable of performing an up and down motion in the direction crossing a seating surface; positioning substrate keys at a position previously set with respect to a measuring unit by using a stage for controlling the positions of the substrate pins on a plane parallel to the seating surface; seating the substrate on the seating surface by moving down the substrate pins; positioning, at a position previously set with respect to the substrate key, a mask mark of a mask arranged on the mask pins by using the stage for controlling the positions of the mask pins on the plane wherein the mask pins can move up and down in the direction crossing the seating surface; and seating the mask on the substrate seated on the seating surface by moving down the mask pins. [Reference numerals] (600) Controller