| 摘要 |
The present invention relates to a semiconductor device to enable users to check through silicon via (TSV) connection on a wafer. The semiconductor device comprises a first metal on the top of a through-electrode; a second metal and a third metal on both sides of the first metal to be electrically connected to the through-electrode; and a forth metal on the top of the first metal to be electrically connected to the first metal. [Reference numerals] (105) First circuit region; (106) Second circuit region |
