FLEXIBLE SUBSTRATE WITH BURIED METAL TRACE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a flexible substrate with a buried metal wiring and a manufacturing method thereof and, more specifically, to a flexible substrate with a buried metal wiring and a manufacturing method thereof capable of efficiently burying the metal wiring in a base substrate based on a specific energy source. The method for manufacturing the flexible substrate with the buried metal wiring according to the present invention includes: a first step for including the metal wiring in the base substrate surface of thermoplasticity; a second step for softening an area including a part which is in contact with the metal wiring in the base substrate; and a third step for burying the metal wiring in the base substrate by adding external force to the metal wiring, wherein the second step is performed by radiating microwaves and heating the metal wiring.