| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which achieves an insulating layer having a low coefficient of linear expansion and in which a roughened surface exhibits high adhesion to a plated conductor in spite of the fact that roughness of the roughened surface obtained by roughening the surface of the cured product of the epoxy resin composition is relatively small. SOLUTION: The epoxy resin composition comprises (A) an epoxy resin, (B) an active ester compound, (C) a phenol resin having a triazine structure, (D) a maleimide compound and (E) a phenoxy resin. COPYRIGHT: (C)2010,JPO&INPIT |
