发明名称 |
Carbon nanotube thermal interface structures |
摘要 |
<p>The invention relates to a process of forming a thermal interface that employs carbon nanotubes to reduce thermal resistance between an electronic device and a cooling solution. Bundles of aligned nanotubes receive injected polymeric material to produce a polymeric/carbon composite which is then placed between the electronic device and a heat sink or other cooling solution.</p> |
申请公布号 |
EP1329953(B1) |
申请公布日期 |
2014.01.22 |
申请号 |
EP20020258760 |
申请日期 |
2002.12.19 |
申请人 |
INTEL CORPORATION |
发明人 |
MONTGOMERY, STEPHEN W.;HOLALKERE, VEN R. |
分类号 |
G06F1/20;H01L23/433;B82Y10/00;F28F13/00;F28F21/00;F28F21/02;H01L23/373;H05K7/20 |
主分类号 |
G06F1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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