| 摘要 |
PURPOSE: An image sensor module and a manufacturing method thereof are provided to improve bonding flatness by extending the surface area of photosensitivity ink coated on a circuit board. CONSTITUTION: An image sensor is bonded to the upper part of a circuit board. A copper thin layer (12) is formed in one surface of a core layer. A pattern part (12a) has a mesh pattern. The pattern unit is formed in the copper thin layer. A surface layer (13) is formed by coating the copper thin layer with photosensitivity ink. |
