| 摘要 |
The present invention relates to a semiconductor chip which is capable of mounting on a printed circuit board. The semiconductor chip comprises: a signal generating module (211, 213; 212, 214, 216) for generating a first signal and a second signal; a first output node (251; 253) for transmitting the first signal; and a second output node (252; 219; 301) for transmitting the second signal, wherein the phase of the second signal is opposite to that of the first signal; wherein the second output node (219, 252, 301, 403, 407) is utilized for connecting a terminator device (205, 209) mounted on the printed circuit board. |
