| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-pattern wiring substrate, where swelling and separation are less apt to occur between an insulating resin layer and a dummy pattern. SOLUTION: The multi-pattern wiring substrate 10 includes the insulating resin layer 1b, where conductive layers 2b are formed thereon and the insulating resin layer 1a, which is laminated on the insulating resin layer 1b and where conductive layers 2a are formed on the front surface. The multi-pattern wiring substrate is a substrate, where a plurality of product regions 3 to be compact wiring substrates having wiring conductors formed of the conductive layers 2a, 2b are arrayed at the center part, and also a frame shape sacrifice region 4 is formed in the outer circumferential part, in which multiple block shape dummy patterns 6a, 6b formed of the conductive layers 2a, 2b are arranged mutually at prescribed interval. The dummy patterns 6a, 6b are mutually arranged by deviation so that parts, where the dummy patterns 6a, 6b do not vertically exist, are formed in a rectangular ring shape or a rectangular shape and are distributed in the sacrifice region 4. COPYRIGHT: (C)2011,JPO&INPIT |
