发明名称 POLYIMIDE RESIN COMPOSITION, FILM, ADHESIVE AND COMPONENT
摘要 <p>The polyimide resin composition of the present invention at least comprises a polar solvent and a polyimide resin, where the viscosity-average molecular weight of the polyimide resin is 0.6 to 1.60. 95 to 100 mol% of total monomer of the polyimide resin is an aromatic monomer including no aliphatic chain having 3 or more carbon atoms on the main chain, where the aromatic monomer includes a monomer (A) having at least one benzophenone skeleton represented either by chemical formula (1) or (2) in an amount of 5 to 30 mol% in the total monomer, a monomer (B) having a diphenyl ether skeleton, which is free of a biphenyl skeleton, in an amount of 40 to 95 mol% in the total monomer, and a monomer (C) having a biphenyl skeleton in an amount of less than 45 mol% in the total monomer, and 20 to 95 mol% of the monomer (B) in the total monomer constituting the polyimide resin has three or more aromatic rings.</p>
申请公布号 KR20140009527(A) 申请公布日期 2014.01.22
申请号 KR20137031420 申请日期 2013.06.05
申请人 MITSUI CHEMICALS, INC. 发明人 TOMITA YUSUKE;IIDA KENJI;IMAGAWA KIYOMI;KIBA SHIGEO
分类号 C08G73/10;C08J5/18;C08L79/08;C09J179/08 主分类号 C08G73/10
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