| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of obtaining thinning of a semiconductor element, and excelling in connection reliability. <P>SOLUTION: The method of manufacturing a semiconductor device includes the processes of sticking an adhesive sheet, including an adhesive layer 3, a pressure-sensitive adhesive layer 2 and a plastic sheet 1 having a modulus of elasticity ≤450 MPa, in this order, on a surface formed with projection electrodes of a semiconductor wafer 20 having the projecting electrodes, each being constituted of a bump 22 and a solder ball 24 arranged on the bump to embed the projection electrodes by the adhesive layer; thinning the semiconductor wafer 20, by polishing a surface on the side opposite to the side formed with the projection electrodes of the semiconductor wafer 20 with the adhesive sheet stuck thereto; obtaining each semiconductor element with an adhesive, by cutting the thinned semiconductor wafer 20 and the adhesive layer; and obtaining a structure where a wiring circuit board and the semiconductor element are electrically connected to each other via the solder balls 24, and the area between the wiring circuit board and the semiconductor element is sealed with the adhesive. <P>COPYRIGHT: (C)2011,JPO&INPIT |
