发明名称 |
Wiring substrate, method for manufacturing wiring substrate, electronic device and method for manufacturing electronic device |
摘要 |
A wiring substrate includes: a substrate; an insulator formed in the substrate and having a through hole; an electrode formed in the substrate and provided within the through hole; and a conductor bonded to the electrode and provided within the through hole, wherein the through hole has a shape that is widened toward a direction away from the substrate, and the conductor is configured to cover the entire top surface of the electrode and has a shape that is widened toward the direction away from the substrate. |
申请公布号 |
EP2688099(A2) |
申请公布日期 |
2014.01.22 |
申请号 |
EP20130173004 |
申请日期 |
2013.06.20 |
申请人 |
FUJITSU LIMITED |
发明人 |
FUKUMORI, TAIGA;MIZUTANI, DAISUKE;KURASHINA, MAMORU |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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