发明名称 |
Laser processing apparatus and method |
摘要 |
A laser processing apparatus includes a stage unit moving a substrate having a plurality of work sections along longitudinal and lateral axes and rotating the substrate at a predetermined angle about a rotational axis, a laser beam oscillating unit oscillating laser beams to process holes in the substrate, a camera unit taking and providing an image of each of the work sections, and a controller correcting a processing location data using the image taken by the camera unit to allow the laser oscillating unit and the scanner unit to accurately process the holes in the substrate. |
申请公布号 |
US8633421(B2) |
申请公布日期 |
2014.01.21 |
申请号 |
US20080334429 |
申请日期 |
2008.12.12 |
申请人 |
YOON DO YOUNG;NA GI LYONG;JUN YOUNG JIN;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
YOON DO YOUNG;NA GI LYONG;JUN YOUNG JIN |
分类号 |
B23K26/00;B23K26/08 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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